Wire wafer fabricating process

Details Wire wafer fabricating process Wire wafer fabricating process

1980-09-18

1982-11-30

McQuade, John

Wireworking

Wire cutting and straightening

Predetermined lengths

83198, B21F 1100

Patent

active

043611745

ABSTRACT:
A process for fabricating wire wafers from wire stock wherein the wire stock is fed against a wire stop member, surrounded by a support member having wire cut-off and back-up tools located integral to the support member with the wire cut-off and back-up tools activated to provide first and second wire wafers and de-activated to return the wire cut-off and back-up tools to a position for a succeeding cycle.

REFERENCES:
patent: 601593 (1898-03-01), Shuster
patent: 3060774 (1962-10-01), Warkoczewski
patent: 3972257 (1976-08-01), Lazar, Jr.
patent: 4128027 (1978-12-01), Fuchs

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