Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate
2006-09-11
2009-06-02
Chambliss, Alonzo (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
C438S126000, C438S127000, C438S617000, C257S782000, C257S784000, C257S787000, C257S790000, C257SE23024
Reexamination Certificate
active
07541222
ABSTRACT:
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.
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Dimaano Jr. Antonio B.
Do Byung Tai
Guillermo Dennis
Magno Sheila Rima C.
Chambliss Alonzo
Ishimaru Mikio
Stats Chippac Ltd.
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