Wire sweep resistant semiconductor package and manufacturing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

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Details

C438S126000, C438S127000, C438S617000, C257S782000, C257S784000, C257S787000, C257S790000, C257SE23024

Reexamination Certificate

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07541222

ABSTRACT:
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A sealant is applied on the die at the conductive wires for preventing wire sweep and the sealant is free of contact with the interposer. The die, the interposer, the conductive wires, and the sealant are encapsulated in an encapsulant.

REFERENCES:
patent: 5331205 (1994-07-01), Primeaux
patent: 5561329 (1996-10-01), Mine et al.
patent: 5863810 (1999-01-01), Kaldenberg
patent: 6211574 (2001-04-01), Tao et al.
patent: 6531762 (2003-03-01), Liao et al.
patent: 6762490 (2004-07-01), Suzuki
patent: 6955949 (2005-10-01), Batish et al.

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