Wire support and guide

Details Wire support and guide Wire support and guide

1991-12-20

1994-12-27

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257676, 257684, 257704, 361730, 361728, H01L 2302

Patent

active

053767560

ABSTRACT:
Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.

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