Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1994-04-08
1995-07-04
Ledynh, Bot
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
257676, 257684, 257704, 257787, 361728, 361730, 174 522, H01L 2302
Patent
active
054302501
ABSTRACT:
Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.
King Patrick T.
Ledynh Bot
VLSI Technology Inc.
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