Wire stacked bonding method

Details Wire stacked bonding method Wire stacked bonding method

1987-10-27

1989-10-24

Seidel, Richard K.

Metal fusion bonding

Process

Plural joints

228 45, 219 561, 219 5622, 361405, H01L 2160

Patent

active

048756180

ABSTRACT:
The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad area is very small.

REFERENCES:
patent: 3669333 (1972-06-01), Coucoulas
patent: 4388512 (1983-06-01), Salzer et al.
patent: 4390771 (1983-06-01), Kurtz et al.
patent: 4465913 (1984-09-01), Stokoe et al.
patent: 4732313 (1988-03-01), Kobayashi et al.
Electronic Packaging & Production, Feb. 1984, pp. 124-127, Chicago, US: "Automatic Bonders Simplify LSI Computer Manufacturing".
Patent Abstracts of Japan, vol. 4, No. 40, (E-4) [522], Mar. 28, 1980, p. 97 E 4; & JP-A-55 12 712 (Tokyo Shibaura Denki K.K.) 29-01-1980.
Patent Abstracts of Japan, vol. 4, No. 137, (E-27)[619], Sep. 25, 1980, p. 15 E 27; & JP-A-55 88 348 (Tokyo Shibaura Denki K.K.)04-07-1980.

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