Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits
Patent
1987-10-01
1989-08-22
Nimmo, Morris H.
Electricity: conductors and insulators
Conduits, cables or conductors
Single duct conduits
29850, H05K 100
Patent
active
048598070
ABSTRACT:
This invention relates to interconnection circuit boards and processes for making and modifying interconnection circuit boards wherein adhesive is applied to a wire used in scribing a conductor pattern. The adhesive is activated to a tacky state during the wire scribing operation which forms the conductor pattern, and can thereafter be cured to permanently bond the conductors to the board surface.
REFERENCES:
patent: 3353263 (1967-11-01), Helms
patent: 3674602 (1972-07-01), Keogh et al.
patent: 3674914 (1972-07-01), Burr
patent: 3981076 (1976-09-01), Nicolas
patent: 4031612 (1977-06-01), Nicolas
patent: 4219927 (1980-09-01), Fukutomi et al.
patent: 4327124 (1982-04-01), Des Marais, Jr.
patent: 4337573 (1982-07-01), Nicolas et al.
patent: 4414741 (1983-11-01), Holt
patent: 4450623 (1984-05-01), Burr
patent: 4588468 (1986-05-01), McGinty et al.
patent: 4642321 (1987-02-01), Schoenberg
patent: 4662963 (1987-05-01), Varker
patent: 4679321 (1987-07-01), Plonski
patent: 4693778 (1987-09-01), Swiggett et al.
patent: 4711026 (1987-12-01), Swiggett et al.
Floury et al., "An Automatic Wiring Equipment for Hybrid Substrates", Proc. 32nd Electronic Comp. Conf., May 1982.
Werbisky et al., "Making 100,000 Circuits Fit Where at Most 6,000 Fit Before", Electronics, vol. 52, No. 15, Aug. 2, 1979.
Miller, Carl, "Soldering with Light", Photonics Spectra, May 1983, pp. 83-85.
Loefler, Jr. J. R., N/S, "Laser Soldering Fast, Low Cost, No Rejects", Assembly Engineering, Mar. 7, 1977, pp. 32-34.
Augat, Inc., "Augat Planar Stitch Wiring", 1983.
Additive Technology Corp., The Wire Ink Company, 1983.
Crowell Jonathan C.
Friedrich Marju L.
Keogh Raymond J.
Morino Ronald
Schoenberg Andrew J.
Kollmorgen Technologies Corporation
Nimmo Morris H.
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