Wire saw, repair station, maintenance and testing station for a

Details Wire saw, repair station, maintenance and testing station for a Wire saw, repair station, maintenance and testing station for a

1998-04-07

2000-04-18

Scherbel, David A.

Stone working

Sawing

Reciprocating

125 21, B28D 108

Patent

active

060502541

ABSTRACT:
A wire saw for cutting wafers from a workpiece, has a cutting head in which at least two adjacent wire-guiding rollers are mounted rotatably in each case between a moveable bearing and a fixed bearing. These are adjacent wire-guiding rollers, together with a wire wound around them, form a wire web. Each wire-guiding roller and the moveable bearing and fixed bearing assigned to it form a wire-guiding-roller unit, which can only be removed from the cutting head as an entire unit. There is also a repair station and a maintenance and testing station for the wire-guiding-roller unit and a method of exchanging the wire-guiding-roller unit.

REFERENCES:
patent: 3831576 (1974-08-01), Mech
patent: 5269285 (1993-12-01), Toyama et al.
patent: 5564409 (1996-10-01), Bonzo et al.
patent: 5575189 (1996-11-01), Kiuchi et al.
patent: 5616065 (1997-04-01), Egglhuber
patent: 5758633 (1998-06-01), Hauser
Derwent Abstract corresponding to CH-677895 A.
Derwent Abstract corresponding to CH 679136 A.
Patent Abstracts of Japan, vol. 13, No. 458 (M-880), & JP 01177960 A (Sumno Metal Ind, Ltd.)

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