Wire saw and process for slicing multiple semiconductor ingots

Details Wire saw and process for slicing multiple semiconductor ingots Wire saw and process for slicing multiple semiconductor ingots

2005-09-13

2005-09-13

Shakeri, Hadi (Department: 3723)

Stone working

Sawing

Reciprocating

C125S021000, C125S035000

Reexamination Certificate

active

06941940

ABSTRACT:
A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). A slurry delivery system includes nozzles (34, 36, and38) positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

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