Wire-saw and its manufacturing method

Details Wire-saw and its manufacturing method Wire-saw and its manufacturing method

1999-03-09

2000-06-06

Rada, Rinaldi I.

Stone working

Sawing

Saw teeth

125 21, 125 1602, B28D 500

Patent

active

060705701

DESCRIPTION:

BRIEF SUMMARY
FIELD OF THE INVENTION

The present invention relates principally to a wire saw for use in working of electronic materials such as slicing a large-diameter silicon ingot into wafers thereof and working of optical materials such as glass lens cutting and to a method for manufacturing such a wire saw.


PRIOR ART

Heretofore, inner saws or inside diameter blades of diamond have been used for slicing a silicon ingot into wafers, but recently as silicon ingots have increasingly larger diameters it has become prevalent to use loose abrasives and wire saws for such works due to yield, productivity, affected layers, dimensional constraints and the like factors.
However, since working with loose abrasives involves not only a problem of environmental health but a cleaning operation requisite thereto leading to an elongated process line or working time in addition to its insufficient working efficiency and precision, it is now highly needed in the industry to use for such working operations wire saws comprising wires with fixed superadhesives.
A wire saw of the above-mentioned type has been disclosed, for example, in Japanese Preliminarily Laid-open Publication No. Sho 50-102993, which comprises a core wire with superadhesives bonded thereto and a dressing layer applied to the external surface of the core wire having the superabrasives layer, while Japanese Preliminarily Laid-open Publication No. Hei 8-126953 has discussed in detail the characteristic features of wire saws when used for silicon wafer slicing operation, suggesting an advantage of the use of polyethylene, nylon or the like as a material of core wires for such wire saws.
Further, Japanese Preliminarily Laid-open Publication No. Hei 9-155631 suggests use of electroplating process or a synthetic resin binder solution to fix diamond abrasives on to a core wire.
The aforementioned solutions certainly have improvements over the art preceding thereto, respectively. However, for permitting commercial-scale production of such wire saws to reach a level of practical applications, it is necessary to disclose and provide a structure of a wire saw having fixed hard abrasives ranging from conventional abrasives such as SiC and Al.sub.2 O.sub.3 to so-called superabrasives such as diamond and CBN (cubic boron nitride) together with advantages resulting from that structure and also to provide a method of manufacturing such a wire saw.


SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to solve the foregoing problems of the prior art by providing a wire saw and a method of manufacturing the same, in which in a first aspect thereof there are provided a high-strength core wire having abrasives fixed onto the outer peripheral surface thereof and a resin bond layer, the grain size of said abrasives being not smaller than two-thirds the thickness of said resin bond layer but not exceeding a half the diameter of said core wire, the resin bond of said resin bond layer comprising a resin having a modulus of elasticity of 100 kg/mm.sup.2 or above and a softening temperature of 200.degree. C. or above, said resin containing a filler having a grain size smaller than two-thirds the thickness of said resin bond layer.
The aforementioned abrasives grain size must be larger than or equal to two-thirds the resin bond layer thickness, because if it is smaller than said thickness it will be difficult for the abrasives to exist for at a part thereof on the surface of the resin bond layer and at the same time to protrude outward from said surface.
Also, if the abrasive grain size exceeds a half the core wire diameter, it will be difficult to retain the abrasive grains in place, resulting in reduced cutting ability. Further, to secure a high cutting precision for a long period, the abrasive grain size should preferably be up to about one-third the core wire diameter.
The filler, which is embedded in the resin bond layer just for reinforcing the resin bond, may have a grain size smaller than two-thirds the resin bond layer thickness.
As the high-strength core

REFERENCES:
patent: 4015931 (1977-04-01), Thakur
patent: 4139659 (1979-02-01), Ronnquist et al.
patent: 4384564 (1983-05-01), Smith et al.
patent: 5454750 (1995-10-01), Cosmano et al.

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