Wire saw

Details Wire saw Wire saw

1996-04-04

1998-02-10

Eley, Timothy V.

Stone working

Sawing

Reciprocating

125 21, B28D 108

Patent

active

057158070

ABSTRACT:
A wire saw for slicing a semiconductor single crystal ingot with which alignment of the crystallographic orientation of the ingot is simple and easy in a slicing process and a method for slicing the ingot by means of the wire saw. Main rollers are three-dimensionally arranged with a predetermined distance between each other, and a wire runs over the main rollers to form arrays of wire portions parallel to each other, with said wire saw an ingot being sliced into rods by pressing it to an array of wire portions between a pair of main rollers that are used to slice the ingot, while the wire is being driven and slurry is fed to the array of wire portions between the pair of main rollers, wherein the wire runs over the pair of main rollers used for slicing in a ratio of one turn over the pair of main rollers to more than one turn over the other main roller or rollers so that the array of wire portions running over the pair of main rollers used for slicing can be arranged at a desired pitch.

REFERENCES:
patent: 3831576 (1974-08-01), Mech
patent: 4574769 (1986-03-01), Ishikawa
patent: 4640259 (1987-02-01), Shimizu
patent: 5201305 (1993-04-01), Takeuchi
patent: 5564409 (1996-10-01), Bonzo et al.

Affiliated with

Also associated with

Rating

Wire saw does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire saw, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire saw will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2069826