Wire material plating equipment

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – Running length work

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C118S069000, C118S420000

Reexamination Certificate

active

10500108

ABSTRACT:
An apparatus for plating a wire material is provided in which a range of the plated layer where the temperature is high and flowability is large, thus, easily generating thickness deviation, and a range of the plated layer where the temperature is low and the flowability is small, thus generating thickness deviation only with difficulty are allowed to cool in an appropriate manner, respectively, whereby a plated wire material whose thickness deviation is not more than 2.0 can be produced with high productivity in a stable manner.In an apparatus for plating a wire material having an air cooling device provided on an upper portion of a plate-squeezing portion on a plating bath surface so that the wire material is standing up from the plating bath via the plate-squeezing portion, the air cooling device comprising an air compressor portion, a lower cooling portion below the air compressor portion, and an upper cooling portion above the air compressor potion; the wire material passing through the air cooling device is air-cooled in two stages by a main cooling air flowing from an air injection hole of the air compressor portion into the upper cooling portion then flowing out from the upper cooling portion from an exit at an upper end and by a secondary cooling air, being sucked into the main cooling air, flowing from an inlet of the lower cooling portion at the lower end thereof into the lower cooling portion and then being jointed to the main cooling air.

REFERENCES:
patent: 2736548 (1956-02-01), Orr et al.
patent: 4171394 (1979-10-01), Patil et al.
patent: 4-18344 (1992-06-01), None
patent: 10-60615 (1998-03-01), None
patent: 11-323524 (1999-11-01), None
patent: 2000-45056 (2000-02-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire material plating equipment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire material plating equipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire material plating equipment will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3778391

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.