Wire looping method during wire bonding

Details Wire looping method during wire bonding Wire looping method during wire bonding

1990-02-05

1993-06-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

228 45, 2281802, 437220, 437923, B23K 3700

Patent

active

052159400

ABSTRACT:
A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.

REFERENCES:
patent: 3819102 (1974-06-01), Isobe
Tummala, et al., Eds. Microelectronics Packaging Handbook, Van Nostrand Reinhold, N.Y. (1989) pp. 403-405.
Chemical Abstracts 104(10): 73164q.
Chemical Abstracts 109(26): 241786k.
Chemical Abstracts 76(8): 38990e.

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