Wire loop and method of forming the wire loop

Details Wire loop and method of forming the wire loop Wire loop and method of forming the wire loop

2008-01-30

2011-11-01

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S612000, C438S617000, C257SE21509

Reexamination Certificate

active

08048720

ABSTRACT:
A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.

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International Search Report dated Oct. 24, 2008, for International Application No. PCT/US2008/052378.

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