Wire guide insert and method for drum package payoff

Winding – tensioning – or guiding – Wound storage package – Housing or outer peripheral support

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C242S566000, C242S588600, C242S615300, C206S409000

Reexamination Certificate

active

07866586

ABSTRACT:
Arrangements and methods for welding wire payoff sources. A tapered core and base plate, optionally along with a wire guide insert, are configured with a payout drum package and a cover containing a welding wire stack such that the welding wire may be payed off smoothly from the wire stack during an arc welding operation, without the welding wire flipping or tangling.

REFERENCES:
patent: 2833912 (1958-05-01), Royer
patent: 3119042 (1964-01-01), Marshall
patent: 3902679 (1975-09-01), Bost
patent: 4135679 (1979-01-01), Murphy et al.
patent: 4179056 (1979-12-01), Schmerling
patent: 4202509 (1980-05-01), Horn
patent: 4253624 (1981-03-01), Colbert
patent: 4404457 (1983-09-01), Rokujio et al.
patent: 4512533 (1985-04-01), Morival et al.
patent: 4531682 (1985-07-01), Schroder et al.
patent: 4657204 (1987-04-01), Colbert
patent: 4754937 (1988-07-01), Hoddinott et al.
patent: 4869367 (1989-09-01), Kawasaki et al.
patent: 5657935 (1997-08-01), Cooper
patent: 5758834 (1998-06-01), Dragoo et al.
patent: 6903305 (2005-06-01), Mukai et al.
patent: 7004419 (2006-02-01), Hsu
patent: 7178755 (2007-02-01), Hsu et al.
patent: 2003/0230660 (2003-12-01), Vernam
patent: 2004/0155090 (2004-08-01), Jensen
patent: 2004/0211851 (2004-10-01), Barton et al.
patent: 2005/0224381 (2005-10-01), Bae et al.
patent: 2006/0102505 (2006-05-01), Hsu et al.
patent: 1 057 751 (2000-12-01), None
patent: 1 621 503 (2006-02-01), None
patent: 1 583 750 (1981-02-01), None
patent: 2001 138052 (2001-05-01), None
PCT/IB2008/002139 International Search Report.
PCT/IB2008/002145 International Search Report dated Feb. 5, 2009.
PCT/IB2008/002139 International Preliminary Report of Patentability dated Sep. 24, 2009.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Wire guide insert and method for drum package payoff does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire guide insert and method for drum package payoff, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire guide insert and method for drum package payoff will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2626840

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.