Wire-free chip module and method

Details Wire-free chip module and method Wire-free chip module and method

2011-08-23

2011-08-23

Pizarro, Marcos D (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S690000, C257S778000, C257SE23044, C257SE23141, C257SE21506, C438S123000

Reexamination Certificate

active

08004070

ABSTRACT:
A wire-free chip module and method. The wire-free chip module including a conductive pattern formed from at least a portion of a lead frame, the conductive pattern including a plurality of pads; at least two electrical components that includes an integrated circuit and a passive component, the integrated circuit and the passive component bonded to the plurality of pads by solder; and wherein the conductive pattern is disposed to interconnect at least a portion of the integrated circuit with the passive component.

REFERENCES:
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 6008999 (1999-12-01), Marrero
patent: 6232148 (2001-05-01), Ma et al.
patent: 6238950 (2001-05-01), Howser et al.
patent: 6388336 (2002-05-01), Venkateshwaran et al.
patent: 7176506 (2007-02-01), Beroz et al.
patent: 2005/0280163 (2005-12-01), Schaffer et al.

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