Wire form heat sink retention module

Details Wire form heat sink retention module Wire form heat sink retention module

2006-03-07

2006-03-07

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C257S718000, C257S719000, C257S727000, C165S080300, C165S185000, C024S458000, C024S513000

Reexamination Certificate

active

07009844

ABSTRACT:
A retention module firmly secures a heat sink for a computer chip. The retention module is oriented about the computer chip on a circuit board. The retention module has a rotatable wire form that has two loops. When the rotatable wire form is rotated, the two loops press against an impingement shelf on the heat sink, forcing the heat sink against the retention module and the computer chip. The two loops are angularly offset to each other, thus compensating for torsion lag between the two loops when the two loops are pressed against the impingement shelf.

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