Wire form heat exchange element

Details Wire form heat exchange element Wire form heat exchange element

1982-07-06

1984-08-14

Davis, Jr., Albert W.

Heat exchange

Heat transmitter

357 81, 361389, F28F 700, H01L 2334

Patent

active

044651309

ABSTRACT:
The present disclosure describes a heat exchange element for attachment to the external surface of a package containing an integrated circuit chip or die. The element has particular application in high density electronic packaging configurations, where space limitations severely curtail the volume which can be occupied thereby. The structure of the present element is such that both the effective cooling area per given volume and the heat transfer coefficient are maximized. Basically the element is an integral structure comprised of a generally helical wire form with substantially elliptic turns wrapped around a metallic plate in symmetrical fashion and in intimate contact with opposed edges of the latter. The wire form provides a plurality of parallel closely spaced-apart cylindrical sections capable of being disposed in an air stream for dissipating the heat generated in the integrated circuit package to which the element is attached.

REFERENCES:
patent: 1146117 (1915-07-01), Wolfe
patent: 1699542 (1929-01-01), Murray
patent: 2238532 (1941-04-01), Nothe
patent: 3372741 (1968-03-01), Kaiser et al.

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