Specialized metallurgical processes – compositions for use therei – Processes – Electrothermic processes
Patent
1986-03-26
1987-06-30
Rosenberg, Peter D.
Specialized metallurgical processes, compositions for use therei
Processes
Electrothermic processes
420469, C22B 900
Patent
active
046768270
ABSTRACT:
The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. At least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.
REFERENCES:
patent: 2743199 (1956-04-01), Hull
patent: 3525605 (1970-08-01), Pynna
patent: 4477324 (1984-10-01), Cline
patent: 4537743 (1985-08-01), Yamanaka
patent: 4537745 (1985-08-01), Hassler
Hosoda Naoyuki
Morikawa Masaki
Ono Toshiaki
Uchiyama Naoki
Yoshida Hideaki
Mitsubishi Kinzoku Kabushiki Kaisha
Rosenberg Peter D.
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