Metal treatment – Stock – Copper base
Patent
1987-04-09
1988-01-05
Rutledge, L. D.
Metal treatment
Stock
Copper base
420469, 420499, 420500, 428606, C22C 900
Patent
active
047174366
ABSTRACT:
The present invention eliminates the problems associated with the use of oxygen-free copper and other high-purity copper materials as bonding wires. In accordance with one aspect of the present invention, at least one rare earth element, or at least one element selected from the group consisting of Mg, Ca, Ti, Zr, Hf, Li, Na, K, Rb and Cs, or the combination of at least one rare earth element and at least one elemented selected from the above-specified group is incorporated in high-purity copper as a refining component in an amount of 0.1-100 ppm on a weight basis, and the high-purity copper is subsequently refined by zone melting. The very fine wire drawn from the so refined high-purity copper has the advantage that it can be employed in high-speed ball bonding of a semiconductor chip with a minimum chance of damaging the bonding pad on the chip by the ball forming at the tip of the wire.
In accordance with another aspect of the present invention, 0.5-3 ppm of a rare earth element and/or Y is further incorporated as an alloying component in the zone-refined high-purity copper.
REFERENCES:
patent: 2743199 (1956-04-01), Hull
patent: 3525605 (1970-08-01), Pynna et al.
patent: 4497324 (1984-10-01), Cline
patent: 4537743 (1985-08-01), Yamanaka et al.
patent: 4537745 (1985-08-01), Hassler et al.
patent: 4676827 (1987-06-01), Hosoda et al.
Metal Progress Databook, Mid-Jun. 1978, pp. 90-91.
Hosoda Naoyuki
Morikawa Masaki
Ono Toshiaki
Uchiyama Naoki
Yoshida Hideaki
Mitsubishi Kinzoku Kabushiki Kaisha
Rutledge L. D.
Wyszomerski George
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