Wire enamel with low soldering temperature

Details Wire enamel with low soldering temperature Wire enamel with low soldering temperature

1976-09-13

1978-09-19

Lieberman, Allan

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

252 637, 260 3340R, 260 3360B, 260 336R, 428378, 428379, C08K 501, C08K 513, C08L 7908, H01B 322

Patent

active

041153421

ABSTRACT:
A wire enamel coating composition capable of forming an insulative coating on a wire to provide a solderability of less than 1 second at temperatures as low as 285-315.degree. C and a thermoplastic flow temperature of at least 230.degree. C comprising a predetermined ratio of an imidized polyester resin having a free hydroxyl content of 4-10% by weight and a blocked isocyanate; at least one aromatic solvent, and a catalyst.

REFERENCES:
patent: 3514500 (1970-05-01), Osmond et al.
patent: 3652471 (1972-03-01), Sattler
patent: 3697471 (1972-10-01), Schmidt et al.
patent: 3793250 (1974-02-01), Schmidt et al.
patent: 3852246 (1976-12-01), Schmidt et al.
patent: 3896089 (1975-07-01), Noda et al.

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