Wire enamel with low soldering temperature

Details Wire enamel with low soldering temperature Wire enamel with low soldering temperature

1976-09-13

1978-08-29

Lieberman, Allan

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

252 632, 252 637, 260 334UR, 260 336UB, 428379, C08K 501, C08K 513, C08L 7504, H01B 320

Patent

active

041102975

ABSTRACT:
A wire enamel coating composition capable of forming an insulative coating on a wire to provide a solderability of less than 1 second at temperatures as low as 285.degree.-315.degree. C. and a thermoplastic flow temperature of at least 230.degree. C. comprising a predetermined ratio of a polyurethane ester resin having a free hydroxyl content of 4-10% by weight and a blocked isocyanate; at least one aromatic solvent, and a catalyst.

REFERENCES:
patent: 3174950 (1965-03-01), Cordier
patent: 3245960 (1966-04-01), Curtis
patent: 3514500 (1970-05-01), Osmond et al.
patent: 3652471 (1972-03-01), Sattler

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