Wire enamel with low soldering temperature

Details Wire enamel with low soldering temperature Wire enamel with low soldering temperature

1975-04-03

1976-10-26

Lieberman, Allan

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 334, 260 336R, 260 336UB, C08K 501, C08K 513, C08L 7908

Patent

active

039882837

ABSTRACT:
A wire enamel coating composition capable of forming an insulative coating on a wire to provide a solderability of less than 1 second at temperatures as low as 285.degree. -315.degree. C and a thermoplastic flow temperature of at least 230.degree. C comprising a predetermined ratio of an imidized polyester resin having a free hydroxyl content of 4-10% by weight and a blocked isocyanate; at least one aromatic solvent, and a catalyst.

REFERENCES:
patent: 3426098 (1969-02-01), Meyer et al.
patent: 3652471 (1972-03-01), Sattler
patent: 3697471 (1972-10-01), Schmidt et al.
patent: 3793250 (1974-02-01), Schmidt et al.
patent: 3852246 (1974-12-01), Schmidt et al.
patent: 3896089 (1975-07-01), Noda et al.

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