Wire enamel

Details Wire enamel Wire enamel

1979-06-27

1980-10-14

Levin, Stanford M.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 314R, 260 324, 260 326N, 260 328N, 260 332R, 528281, C08K 506, C08K 507, C08K 510, C08K 517

Patent

active

042280591

ABSTRACT:
Polyester-polyimide resins having a hydroxyl value of 150 to 600 and containing repeating units derived from tris-(2-hydroxyethyl) isocyanurate or tris-(2-carboxyethyl) isocyanurate are known valuable film-forming agents in wire enamels. Enamels of low viscosity at high solids content can be prepared by dissolving the resins in solvent systems free from phenols and containing at least 30% (wt.) diacetylacetone, monoalkylesters of ethylene glycol, diethylene glycol and the like, and lower alkanoic acid esters of the ethers, and these solvent components are less irritating and partly less toxic than solvents employed heretofore.

REFERENCES:
patent: 3426098 (1969-02-01), Meyer et al.
patent: 3852246 (1974-12-01), Schmidt et al.

Affiliated with

Also associated with

Rating

Wire enamel does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire enamel, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire enamel will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2100317