Wire/disk board-to-board interconnect device

Details Wire/disk board-to-board interconnect device Wire/disk board-to-board interconnect device

1989-02-03

1989-08-22

Pirlot, David

Electrical connectors

With selectable circuit, e.g., plug board

Planar circuit overlying a second planar circuit, both...

439 65, 439 83, H01R 2900

Patent

active

048591882

ABSTRACT:
An apparatus and method for creating a stack assembly of print circuit boards and for providing electrical interconnection between the individual through-plated hole pads of the circuit boards is described. The preferred embodiment of the present invention is a device comprised of two parts: a slotted disk and a wire. The slotted disk is attached to the surface of the printed circuit board so as to cover a hole pad and form an electrical connection therewith. The covered holes of the printed circuit board are axially aligned between circuit boards and an electrically conducting wire is inserted through the slotted disks on the circuit boards to form an electrical connection therewith.

REFERENCES:
patent: 3022480 (1962-02-01), Tiffany
patent: 3079577 (1963-02-01), Brownfield
patent: 3097032 (1963-07-01), Hochheiser
patent: 3205298 (1965-09-01), Kalt
patent: 3212049 (1965-12-01), Mittler et al.
patent: 3568001 (1971-03-01), Straus
patent: 3619478 (1971-11-01), Staiger
patent: 3670409 (1972-06-01), Reimer
patent: 3718750 (1973-02-01), Sayers
patent: 4076356 (1978-02-01), Tamburro
patent: 4295184 (1981-10-01), Roberts
"Packaging Techniques", K. S. Hinkley, Jr. et al., IMB Technical Disclosure Bulletin, vol. 9, No. 7, Dec. 1966.
"Stack Assembly of Printed Circuit Cards", M. Kubota, IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981.

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