Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...
Reexamination Certificate
2002-07-10
2004-09-07
Chaudhari, Chandra (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Incoherent light emitter structure
In combination with or also constituting light responsive...
C257S776000
Reexamination Certificate
active
06787811
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a wire connection structure and a method of manufacturing the same. More particularly, the present invention relates to a wire connection structure having a characteric feature at the lead-out sections arranged outside the effective display region of a display and a method of manufacturing such a structure.
2. Related Background Art
Light-emitting displays comprising organic EL elements and having a simple matrix structure are known. Japanese Patent Application No. 2000-243558 discloses such a display.
FIG. 16A
of the accompanying drawings schematically illustrates a light-emitting display as disclosed in the above identified patent document. Referring to
FIG. 16A
, there are shown transparent electrodes (anodes)
705
, a glass substrate
703
, a light-emitting layer
707
, a sealing box bonding region
714
, metal electrodes (cathodes)
709
, lead-out/connecting sections
713
and cathode lead-out sections
711
.
FIG. 16B
illustrates how each metal electrode
709
is connected to a cathode lead-out section
711
. In
FIG. 16B
, reference symbol
716
denotes a high melting point metal layer while reference symbols
715
and
719
respectively denote an ITO layer and an insulating member.
The display of the above identified patent document requires a step of arranging insulating members
719
. Furthermore, a metal electrode
709
is arranged on each insulating member
719
so that it can be connected to a corresponding cathode lead-out section
711
only on the top surface of the high melting point metal layer
716
.
Thus, the top surface of each cathode lead-out section
711
has to be dedicated to connection with an metal electrode
709
.
SUMMARY OF THE INVENTION
According to the invention, the above problem is dissolved by providing a wire connection structure comprising a third electrode and a second electrode forming a light-emitting point, the second electrode being electrically connected to a first electrode functioning as a lead-out electrode by way of an electro-conductive member, the electro-conductive member being formed either by an ink-jet method or a gas deposition method.
In another aspect of the invention, there is provided a wire connection structure comprising a third electrode and a second electrode forming a light-emitting point, the second electrode being electrically connected to a first electrode forming a light-emitting point by way of an electro-conductive member, the first electrode having at least top and front sides covered by the electro-conductive member at an end thereof.
In still another aspect of the invention, there is provided a method of manufacturing a wire connection structure comprising a step of forming a first electrode, a step of forming a second electrode, a step of forming a third electrode so as to form a light-emitting point with the second electrode and a step of electrically connecting the first electrode and the second electrode by means of an electro-conductive member, the step of electrically connecting the first electrode and the second electrode including arranging the electro-conductive member either by an ink-jet method or a gas deposition method.
REFERENCES:
patent: 6197418 (2001-03-01), Cloots et al.
patent: 6621104 (2003-09-01), Speckbacher et al.
patent: 2000-243558 (2000-09-01), None
Omizu Satoko
Saito Yasuyuki
Blum David S.
Canon Kabushiki Kaisha
Chaudhari Chandra
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