Image analysis – Applications – Manufacturing or product inspection
Patent
1995-07-06
1997-12-23
Boudreau, Leo
Image analysis
Applications
Manufacturing or product inspection
348126, 2505594, G06K 900, H04N 718, H04N 947
Patent
active
057013624
ABSTRACT:
A wire breakage detecting method, being a method of detecting breakage of wire bonded on a chip of an electronic component by image processing, includes the step of observing a point of the wire as a pixel of one color of binary images of black and white, observing while rotating plural pixels around the present observation pixel being observed in a specific direction, moving the observation point of the wire by detection of the pixel of the same color as said color of the binary images, moving the observation point continuously, and detecting breakage of wire by inversion of the moving direction of the observation point.
REFERENCES:
patent: 5238173 (1993-08-01), Ura et al.
patent: 5412742 (1995-05-01), Takasaki et al.
patent: 5424838 (1995-06-01), Siu
patent: 5574800 (1996-11-01), Inoue et al.
Boudreau Leo
Mehta Bhavesh
Rohm & Co., Ltd.
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