Wire bonding unit using infra-red ray detector

Electricity: motive power systems – Positional servo systems – With particular 'error-detecting' means

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318627, 356172, 250548, G05B 106

Patent

active

040548244

ABSTRACT:
A wire bonding system is disclosed wherein a patterned substrate to be bonded is composed of at least two materials having different emission rates of infra-red rays, and a point to be bonded on the patterned substrate is positioned so as to coincide with a predetermined reference position. The present invention includes a servo-mechanism, which moves the patterned substrate, and a detecting element which scans the surface of the patterned substrate in a linear direction and detects the infra-red rays radiated therefrom. A pattern figure is obtained by using the differences in the emission rate of the infra-red rays caused by the material of the pattern. A signal which indicates the pattern figure is compared with another signal which indicates the reference position, and a control signal, corresponding to the difference between the point on the pattern to be bonded and the reference position, is obtained. The servo-mechanism is controlled by said control signal so that the point to be bonded is placed at the reference position.

REFERENCES:
patent: 3731098 (1973-05-01), Hunt
patent: 3775011 (1973-11-01), Marsh
patent: 3803474 (1974-04-01), Clarke
patent: 3805073 (1974-04-01), Jayachandra et al.
patent: 3955072 (1976-05-01), Johannsmier et al.

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