Wire bonding ultrasonic control system responsive to wire deform

Metal fusion bonding – Process – With condition responsive – program – or timing control

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2281101, 228 45, B23K 106, B23K 2010

Patent

active

053141059

ABSTRACT:
A wire-bonding process for bonding a wire 8 to a contact surface of an electrical or electronic component 10, comprises supplying ultrasonic energy to a bonding tool 2 mounted on an ultrasonic transducer 6, the bonding tool 2 being arranged to press the wire 8 against the contact surface of the electrical or electronic component 10, and monitoring the deformation of the wire 8. The level and duration of the supply of ultrasonic energy and optionally the magnitude of the bonding force are continuously controlled during the bonding process in response to the deformation of the wire, in a closed loop system.

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