Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2007-09-20
2010-02-02
Ward, Jessica L. (Department: 1793)
Metal fusion bonding
Process
Plural joints
C228S105000, C228S004500
Reexamination Certificate
active
07654436
ABSTRACT:
A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
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patent: 2005/0247758 (2005-11-01), Beatson et al.
patent: 2007/0181645 (2007-08-01), Ho et al.
Ho Wing Cheung James
Lam Kam Hong Kenneth
Law Hon Shing Eddie
To Wai Lok Ben
ASM Assembly Automation Ltd.
Ostrolenk Faber LLP
Ward Jessica L.
Yoon Kevin E
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