Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-02-27
2008-09-16
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C438S508000, C438S508000, C257S706000, C257S678000
Reexamination Certificate
active
07425466
ABSTRACT:
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.
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English language abstract of Japanese Publication No. 62-274755.
English language abstract of Japanese Publication No. 63-222450.
English language abstract of Korean Publication No. 10-2001-0025874.
English language abstract of Korean Publication No. 2001-0055041.
Le Dung A.
Narger Johnson & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd
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