Wire bonding system and method

Details Wire bonding system and method Wire bonding system and method

1979-02-02

1981-06-09

Weidenfeld, Gil

Metal fusion bonding

Process

With clamping or holding

228 45, H05K 1306, B23K 112

Patent

active

042720079

ABSTRACT:
A bonding system comprising a solder head; a tip unit for receiving wire to be soldered; a heater for heating the tip unit; drive means for moving the head toward and away from a member to be soldered and for increasing the force of the tip unit on the member to be soldered; means for enabling the drive means to move the tip unit to engage the member and to energize the heater for a predetermined period of time; and means for enabling said drive means to increase for a lesser period of time, during said predetermined period of time, the force between the tip unit and member.

REFERENCES:
patent: 3125906 (1964-03-01), Johnson
patent: 3659770 (1972-05-01), Miller
patent: 3673681 (1972-07-01), Steranko
patent: 3724264 (1973-04-01), Lac Valle
patent: 3812581 (1974-05-01), Larson et al.
patent: 3840169 (1974-10-01), Steranko et al.

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