Wire bonding system

Details Wire bonding system Wire bonding system

1974-11-14

1976-08-10

Smith, Al Lawrence

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228 7, H01L 2192

Patent

active

039737136

ABSTRACT:
A wire bonding system connects wires between electrode pads on a semiconductor pellet fixed on a lead frame to the corresponding lead parts on the lead frame. The lead frame with the pellet fixed thereon is first set in a position beneath a projector, to obtain a magnified image of the pellet, from which the position of the pellet is measured. On the basis of the measured value, a computer calculates positions for bonding the wires. The lead frame with the pellet therein is then set on the wire bonding machine and the positions of the bonding head are controlled using the result of said calculation to carry out wire bonding. The position measuring means is separate from the bonding machine, with an on-line or off-line connection therebetween.

REFERENCES:
patent: 3641660 (1972-02-01), Adams et al.

Affiliated with

Also associated with

Rating

Wire bonding system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire bonding system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire bonding system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1739001