Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Patent
1998-04-21
2000-09-12
Everhart, C.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
438117, 438121, 438123, 438122, 438617, 257688, H01L 23495, H01L 2148, H01L 2150
Patent
active
061181757
ABSTRACT:
A flexible shelf (12) and a method for coupling a semiconductor chip (33) to a leadframe (23) using the flexible shelf (12). The flexible shelf (12) has a mounting portion (16), a flexible portion (17), and a leadframe support portion (18). The flexible shelf (12) is used in a wire bonding support assembly (10) to provide support for the leadframe (23) during wire bonding. The flexible portion (17) of the flexible shelf (12) flexes to increase thermal conductivity between a heater block (29) and the leadframe (23) during wire bonding.
REFERENCES:
patent: 5954842 (1999-09-01), Fogal et al.
Anderson Harold G.
Archibeque, Jr. Gilbert J.
Dykert Stefan M.
Laninga Albert John
Purcell Rodney D.
Everhart C.
Martinez Anthony M.
Motorola Inc.
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