Wire bonding structure and manufacturing method thereof

Details Wire bonding structure and manufacturing method thereof Wire bonding structure and manufacturing method thereof

2009-01-23

2010-12-28

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S780000, C257S784000

Reexamination Certificate

active

07859123

ABSTRACT:
The present invention relates to a wire bonding structure, and more particularly to a manufacturing method for said wire bonding structure. The wire bonding structure comprises a die that connects with a lead via a bonding wire. At least one bond pad is positioned on an active surface of the die, and a gold bump is provided on the bond pad; furthermore, a ball bond can be positioned upon the gold bump. The bond pad and the gold bump can separate the ball bond and the die, which can avoid damaging the die during the bonding process.

REFERENCES:
patent: 6815789 (2004-11-01), Tiziani et al.
patent: 7417324 (2008-08-01), Obiya

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