Wire bonding process and wire bond structure

Details Wire bonding process and wire bond structure Wire bonding process and wire bond structure

2005-03-08

2005-03-08

Edmondson, L. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S004500

Reexamination Certificate

active

06863208

ABSTRACT:
In a wire-bonding process, a chip is provided with at least a first contact pad. A chip carrier is further provided with at least a second contact pad. A plurality of stacked conductive bumps are formed on the first contact pad. A conductive wire is formed by a reverse bonding process. The conductive wire electrically connects the second contact pad of the chip carrier to the stacked conductive bumps over the first contact pad of the chip.

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