Wire bonding misattachment detection apparatus and that detectio

Details Wire bonding misattachment detection apparatus and that detectio Wire bonding misattachment detection apparatus and that detectio

1992-12-01

1993-08-24

Ramsey, Kenneth J.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228 45, H01L 2160

Patent

active

052381730

ABSTRACT:
The present invention provides a wire bonder and its method able to reliably and efficiently perform non-contact detection of the misattachment of wires spread between the pads of various types of bonded components and a lead without damage to said bonded component. The present invention is equipped with a clamp provided above a capillary through which is passed a wire, a toroidal coil provided above the capillary without making contact with the wire, a high frequency oscillator that generates a high frequency to the toroidal coil, and a differentiation circuit that detects whether the wire connected to the bonded component is misattached, so that the present invention is able to detect whether the wire to be connected to the bonded component is misattached by this differentiation circuit. Alternatively, the toroidal coil is provided within a path that forms a loop between a clamping device, that performs cutting of the wire, and a bonding stage, without making contact with the line that composes said path.

REFERENCES:
patent: 4213556 (1980-07-01), Persson et al.
patent: 4555052 (1985-11-01), Kurtz et al.
patent: 4821944 (1989-04-01), Tsumura
patent: 5058797 (1991-10-01), Terakado et al.

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