Electric heating – Inductive heating – With heat exchange
Patent
1998-06-17
2000-02-29
Walberg, Teresa
Electric heating
Inductive heating
With heat exchange
219605, 219616, 219243, H05B 610
Patent
active
060312165
ABSTRACT:
A wire bonding apparatus has a first support arrangement for supporting a first integrated circuit package component. A second support arrangement is configured to supporting a second integrated circuit package component. The second support arrangement includes at least a portion of a heating arrangement for heating certain portions of the second component. At least portions of the first support arrangement are thermally insulated from the second support arrangement such that at least certain portions of the first component may be maintained at a temperature substantially lower than the temperature of the heated portions of the second component. The apparatus may be used in method of forming a bonding wire for electrically connecting a first contact on a first integrated circuit package component to a second contact on a second integrated circuit package component. The method includes the steps of supporting and holding the first component and the second component in a desired position. Certain regions of the second component, including the second contact, are heated to a desired temperature while maintaining the temperature of at least certain portions of the first component, including the first contact, at a temperature substantially lower than the heated regions of the second component. A bonding wire is formed that electrically connects the first contact on the first component to the second contact on the second component.
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Singh Inderjit
Vikram Seshadri
Fuqua Shawntina T.
National Semiconductor Corporation
Walberg Teresa
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