Wire bonding method, semiconductor device, capillary for wire bo

Details Wire bonding method, semiconductor device, capillary for wire bo Wire bonding method, semiconductor device, capillary for wire bo

1996-04-08

1998-12-01

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

219 5622, B23K 3102

Patent

active

058426280

ABSTRACT:
A wire bonding method includes a first bonding process for forming a first ball-shaped part in a wire and bonding the first ball-shaped part to a first connected member; a ball-shaped part forming process for guiding the wire away from a position where the wire is bonded to an inner lead so as to form a predetermined loop, and forming a second ball-shaped part in a predetermined position in the wire; and a second bonding process for bonding the second ball-shaped part to a semiconductor element pad that serves as a second connected member.

REFERENCES:
patent: 4142288 (1979-03-01), Flammer et al.
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 4875618 (1989-10-01), Hasegawa et al.
patent: 5431329 (1995-07-01), Hasegawa et al.
patent: 5476211 (1995-12-01), Khandros

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