Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1991-11-13
1992-09-29
Ramsey, Kenneth J.
Metal fusion bonding
Process
With condition responsive, program, or timing control
228 45, 228 8, 228103, 228179, H01L 2190
Patent
active
051508281
ABSTRACT:
A wire bonding method includes a step of calculating the tracking parameters which determine the motion track of a capillary, from a function that has its variables a tracking wire loop length equivalent to the distance between the bonding point on the lead frame and the bonding point on a chip electrode, and amounts that the chips protrude from the positions of the bonding points on the chip electrode to the side of a lead frame electrode, and a step of performing drive control of the capillary in accordance with those calculated values. A wire bonding apparatus used in the method comprises a function generation portion which generates a tracking parameter function, a variable data generation portion in which each bonding object position generates numerical value data for the amount of protrusion and the length, a tracking parameter calculation portion which determines a tracking parameter and outputs numerical value data, and a drive control portion for performing drive control of the capillary according to the numeric value data.
REFERENCES:
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4418858 (1983-12-01), Maller
patent: 4445633 (1984-05-01), Bonham, Jr.
Kabushiki Kaisha Toshiba
Ramsey Kenneth J.
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