wire bonding method and apparatus and method of producing semico

Details wire bonding method and apparatus and method of producing semico wire bonding method and apparatus and method of producing semico

1990-10-02

1991-10-29

Heinrich, Sam

Metal fusion bonding

Process

With condition responsive, program, or timing control

228179, 228 45, 228 9, H05K 332, H01L 2160

Patent

active

050608410

ABSTRACT:
A wire bonding method and apparatus comprising a comparator wherein a difference between a position command signal for displacing a moving member such as, for example, a wire bonding tool, and a position signal obtained from a sensor for detecting the position of the moving member is compared with a predetermined threshold or reference value so that a stopping of the moving member, caused by an external force such as a contact therewith with another member can be rapidly and accurately electrically detected. A wire bonding method and apparatus is useable for producing a semiconductor device.

REFERENCES:
patent: 4444349 (1984-04-01), Bilane et al.
patent: 4597522 (1986-07-01), Kobayashi
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4653681 (1987-03-01), Dreibelbis et al.
patent: 4759073 (1988-07-01), Shah et al.

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