Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1996-10-23

1999-01-26

Ryan, Patrick

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 565, 228105, H01L 2160, B23K 3112

Patent

active

058629742

ABSTRACT:
This method and apparatus for wire bonding allows easy checking and correction of bonding point coordinates in which upon the registration of the coordinates of fixed points used for alignment in a fixed point standard pattern storage memory and the subsequent registration of the coordinates of bonding points in a bonding point coordinate memory, the coordinates of bonding points and the images of pads or leads obtained by a camera at the time of the registration of the coordinates are both registered in an image data storage memory, so that the registered images are displayed on a monitor in cases where bonding point coordinates are checked or corrected at a later time.

REFERENCES:
patent: 5474224 (1995-12-01), Nishimaki et al.
patent: 5516023 (1996-05-01), Kono
patent: 5615821 (1997-04-01), Sasano

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