Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1992-08-10

1993-06-22

Heinrich, Samuel M.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228110, 228 11, 228 8, H01L 21607

Patent

active

052210375

ABSTRACT:
In wire bonding performed in assembling, for example, semiconductor devices, the joining or bonding strength between a ball formed at an end of bonding wire and a bonding point is brought to a satisfactory level because of the use of small diameter balls with a little variation in diameter, and the bonding is performed by setting a load, that is applied on the ball when the ball contacts the bonding point, is set larger than when the ultrasonic waves are applied onto the ball.

REFERENCES:
patent: 3610506 (1971-10-01), Robinson
patent: 3873859 (1975-03-01), Shoh
patent: 4373653 (1983-02-01), Salzer et al.
patent: 4496095 (1985-01-01), Renshaw et al.
patent: 4603802 (1986-08-01), Kurtz et al.
patent: 4854494 (1989-08-01), von Raben
patent: 5078312 (1992-01-01), Ohashi et al.
patent: 5111989 (1992-05-01), Holdgrafer et al.

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