Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1993-07-15

1994-03-29

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

228 45, H01L 21603

Patent

active

052977226

ABSTRACT:
In a wire bonding apparatus and method which reduces variances of the length of tails of bonding wires without increasing the total wire cutting time, a capillary and a wire cutting clamp are moved up fast 10 and then slowly 11, after the wire is bonded to a second bonding point 1, to a-point slightly below a desired tail length S, and then the capillary and the clamp are moved up slowly 12 so that the clamp is closed to cut the wire and then moved up fast 13 and slowly 14 again.

REFERENCES:
patent: 4340166 (1982-07-01), Bilane et al.
patent: 5058797 (1991-10-01), Terakado et al.

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