Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1995-03-20

1997-04-01

Shaw, Clifford C.

Electric heating

Metal heating

Wire, rod, or bar bonding

21914521, B23K 3100

Patent

active

056162570

ABSTRACT:
An electrode used in a wire bonding method and apparatus for applying an electric discharge to an end of a bonding wire so as to form a ball at the end of the bonding wire. The electrode is provided with an obliquely cut surface at one end so that the end of the electrode is in a semicircular shape, and an edge area of the semicircular end surface is positioned to face upward and used as an electric discharge part. The electrode can be covered by a ceramic material except for the semicircular end surface.

REFERENCES:
patent: 3715561 (1973-02-01), Hammarlind
patent: 3950631 (1976-04-01), Schmidt et al.
patent: 4523071 (1985-06-01), Bancroft et al.
patent: 4549059 (1985-10-01), Kamijo et al.
patent: 4594493 (1986-06-01), Harrah et al.
patent: 5110032 (1992-05-01), Akiyama et al.

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