Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

2006-11-28

2006-11-28

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500, C228S102000

Reexamination Certificate

active

07140529

ABSTRACT:
A wire bonding apparatus that include a piezoelectric element4provided near the capillary attachment portion of a bonding arm1so that a capillary3vibrates in the axial direction of the bonding arm1, the piezoelectric element4being driven by a piezoelectric element driving power source11. The wire bonding apparatus further includes a detector15and a bonding arm control circuit16, wherein the detector15detects the voltage or current generated by the piezoelectric element4when the capillary3is lowered and contacts the object of bonding, and the bonding arm control circuit16controls the lowering motion of the bonding arm1in accordance with the changes in the voltage or current detected by this detector15.

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patent: 3245445 (2002-01-01), None

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