Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

2005-09-20

2005-09-20

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S180500, C228S110100

Reexamination Certificate

active

06945446

ABSTRACT:
A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

REFERENCES:
patent: 6449516 (2002-09-01), Kyomasu et al.
patent: 6464126 (2002-10-01), Hayata et al.
patent: 6467673 (2002-10-01), Enokido et al.
patent: 60-242627 (1985-12-01), None
patent: 7-297220 (1995-11-01), None
patent: 8-236567 (1996-09-01), None
patent: 10-9830 (1998-01-01), None
Junichi. Translation to JP 8-236567, pp. 1-9.

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