Metal fusion bonding – Process – With condition responsive – program – or timing control
Reexamination Certificate
2008-05-13
2008-05-13
Stoner, Kiley (Department: 1793)
Metal fusion bonding
Process
With condition responsive, program, or timing control
C228S004500, C228S103000, C228S180500
Reexamination Certificate
active
07370785
ABSTRACT:
A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical direction. This computer 41 includes a memory 60, which stores the detected position of the capillary 5 at the time that secondary bonding is performed on a bump that is formed in a normal manner on the second conductor, and a comparator circuit 61, which outputs a “bump not-adhered” signal in cases where the output value of the height position counter 44 is outside the permissible error range of the detected position that is stored in the memory 60.
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Androlia William L.
Kabushiki Kaisha Shinkawa
Koda H. Henry
Stoner Kiley
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