Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1992-05-29

1993-05-04

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 11, 228 45, 228 10, H01L 21607

Patent

active

052073700

ABSTRACT:
In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.

REFERENCES:
patent: 5011061 (1991-04-01), Funatsu
patent: 5060841 (1991-10-01), Oshima et al.
patent: 5121870 (1992-06-01), Evans et al.

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