Wire bonding method and apparatus

Details Wire bonding method and apparatus Wire bonding method and apparatus

1995-04-27

1997-04-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

2281805, H01L 2160

Patent

active

056158211

ABSTRACT:
A wire bonding method and apparatus for manufacturing semiconductor devices automatically correcting, after predetermined times of bonding executions, any shifts occurring via heat, etc. in an offset distance set between a capillary through which a bonding wire passes and a camera that takes images of leads of a lead frame and pads of a semiconductor chip.

REFERENCES:
patent: 5474224 (1995-12-01), Nishimaki et al.

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