Wire bonding method

Details Wire bonding method Wire bonding method

1987-09-28

1988-08-09

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228213, 228 45, B23K 3102

Patent

active

047622679

ABSTRACT:
This wire bonding method is preferably applied to wire bonding for an elongated semiconductor chip. This method includes a first step of chucking a semiconductor chip by a chuck table to conduct bonding between the bonding pads and electrodes within a bonding region of a wire bonder, a second step of releasing the chucking by the chuck table to convey the semiconductor chip by a predetermined pitch, and a third step of turning the chuck table so that it becomes in alignment with the semiconductor having been conveyed by the predetermined pitch. This method further includes a fourth step of chucking the semiconductor chip by the chuck table to carry out wire bonding between the bonding pads of the semiconductor chip and the electrodes for a second time. Since there is no need to rotate the semiconductor chip in this method, positioning is facilitated and precisely carried out. Thus, bonding operation is simplified and its high speed implementation is possible.

REFERENCES:
patent: 3909933 (1975-10-01), Doubek, Jr. et al.
patent: 4583676 (1986-04-01), Pena et al.
patent: 4597522 (1986-07-01), Kobayashi

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